Research Reports


Semiconductors


As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

2023/06/20

DRAM , AI Server/HBM/Server

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Cloud computing workloads continue to increase rapidly due to the demand coming from a diverse range of applications. However, the limited room for DDR SDRAM to achieve further breakthroughs...

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

2023/06/20

AI Server/HBM/Server

 PDF

Cloud computing workloads continue to increase rapidly due to the demand coming from a diverse range of applications. However, the limited room for DDR SDRAM to achieve further breakthroughs...

Foundry Market Bulletin_20230619

2023/06/19

Wafer Foundries

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Phase 1 for TSMC’s Japanese fab (JASM) is scheduled for a mass production in December 2024 at a preliminary capacity of about 5Kwspm...

Major CSPs’ Engagement in AI Server Infrastructures to Raise HBM and CoWoS Capacity by 30-40% (2023-2024) under Driver of High-End AI Chips

2023/06/15

AI Server/HBM/Server

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As indicated by TrendForce’s observations, the growth of AI servers in 2023 yielded by generated AI applications, such as ChatBOT, are seen with particularly heavy engagement from major CSPs...

Analysis on Development Trends of Liquid Cooling Technology for Data Centers

2023/06/15

AI Server/HBM/Server

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Thermal Design Power (TDP), as server chips improve in computability, is constantly surpassing the limit of power consumption amidst the incessant increase of temperature during summertime under climate change...

Opportunities in Markets for PSUs and Liquid Cooling Solutions Generated by Rapid Growth of AI Servers

2023/06/14

AI Server/HBM/Server

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1. Projection on Development of AI Server Market
2. Comparison of AI Servers and Convention Servers in Terms of Energy Consumption
3. Development Trends in Higher-Spec PSUs and Liquid Cooling Solutions
4. Common Liquid Cooling Solutions for Data Centers
5. Recent Observations on Adoption of Liquid Cooling Solutions Among Server Manufacturers

DRAM Market Bulletin_20230614

2023/06/14

DRAM

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Buyers and suppliers are gradually entering negotiations for 3Q23 contracts. Although the markets for various categories of end products are expected to suffer a YoY decline in demand...

NAND Flash Market Bulletin_20230614

2023/06/14

NAND Flash

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Negotiations for 3Q23 contract prices are about to begin. Despite the established consensus on a deterioration of annual end demand, the outcome could be mitigated due to seasonal effects in 2H23...

LPDDR5X Contract Prices to See Early Stoppage in Reduction from Cost Considerations and Suppliers’ Pricing Strategies

2023/06/13

DRAM

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As indicated by the Semiconductor Research division of global market intelligence firm TrendForce, smartphones, compared to other consumer products...

MLCC Market Bulletin_20230613

2023/06/13

MLCC

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As the end of 2Q23 approaches, the consumer electronics market continues to exhibit weak sales. Furthermore, much of China’s consumer demand that was expended during the May Day holiday went towards travel and dining out...

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