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Monthly Archives: January 2021
Automotive Market Set to Recover in 2021 with Yearly Sales of 84 Million Vehicles, While 12-inch Fab Capacities for Automotive Semiconductor Undergoes Most Severe Shortage, Says TrendForce
Not only did automotive market take a downward turn starting in 2018, but the severe impact of the COVID-19 pandemic in 2020 also led to noticeably insufficient procurement activities from major automotive module suppliers, according to TrendForce’s latest investigations. However, as the automotive market is currently set to make a recovery, TrendForce expects yearly vehicle sales to increase from 77 million units in 2020 to 84 million units in 2021. At the same time, the rising popularity of autonomous, connected, and electric vehicles is likely to lead to a massive consumption of various semiconductor components. Even so, since most manufacturers in the automotive supply chain currently possess a relatively low inventory, due to their sluggish procurement activities last year in light of weak demand, the discrepancies in the inventory levels of various automotive components, along with the resultant manufacturing bottleneck, have substantially impaired automakers’ capacity utilization rates and, subsequently, vehicle shipments.
Posted in Automotive Technologies, Emerging Technologies, Semiconductors, Wafer Foundries
Tagged Broadcom, CIS, DDI, Discrete, GlobalFoundries, IDM, Infineon, MCU, MEMS, NXP, ON Semiconductor, PMIC, Renesas, Samsung, STMicroelectronics, TI, TSMC, UMC, VIS, Win Semiconductor
Comments Off on Automotive Market Set to Recover in 2021 with Yearly Sales of 84 Million Vehicles, While 12-inch Fab Capacities for Automotive Semiconductor Undergoes Most Severe Shortage, Says TrendForce
Mini LED Chip Revenue Likely to Reach US$270 Million in 2021 as Battle Over Mini LED Backlight TV Specs Takes Place, Says TrendForce
As various TV manufacturers such as Samsung, LG, and TCL announced their new models equipped with Mini LED backlights at CES 2021, TrendForce’s 2021 Mini LED New Backlight Display Trend Analysis report shows that total Mini LED chip revenue from Mini LED backlight TVs to potentially reach US$270 million in 2021, as manufacturers gradually overcome technological bottlenecks and lower their overall manufacturing costs, according to TrendForce’s latest investigations.
Posted in LED, Micro LED / Mini LED
Tagged 8K resolution, Apex, AUO, BOE, Chipone, CSOT, DC, driver IC, Elan, Epistar, FitTech, HC SemiTek, HDR, Himax, Hisense, Hongli Zhihui, Innolux, Lextar, LG, LGD, Macroblock, Mini LED, Neo QLED Mini LED TV, Novatek, OLED, OLED TV panel, Parade, QNED Mini LED TV, Samsung, San’an, Saultech, Seoul Semiconductor, TV backlight, Xiaomi, Young Poong Group, YTEC, Zhen Ding Tech
Comments Off on Mini LED Chip Revenue Likely to Reach US$270 Million in 2021 as Battle Over Mini LED Backlight TV Specs Takes Place, Says TrendForce
Shortage Caused by Explosive Growth in Mini LED Demand to Result in 5-10% Price Hike for LED Chips, Says TrendForce
While major OEMs such as Apple and Samsung prepare to release their new notebook computers, tablets, and TVs that are fully equipped with Mini LED backlights this year, various companies in the LED supply chain began procuring Mini LED chips ahead of time in 4Q20, leading to an explosive demand growth for these chips, which in turn crowded out the LED suppliers’ production capacities for other mainstream LED chips, according to TrendForce’s latest investigations. Given this structure-wide shortage of LED chips, certain LED chip suppliers have been raising the quotes on chips supplied to non-core clients and chips with relatively low gross margins. This price hike is estimated at about 5-10%.
Posted in LED, LED Display, Micro LED / Mini LED
Tagged GAPSS, HC SemiTek, Mini LED, price hike, shortage
Comments Off on Shortage Caused by Explosive Growth in Mini LED Demand to Result in 5-10% Price Hike for LED Chips, Says TrendForce
TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H21, Intel’s mid-range and high-end CPUs are projected to enter mass production using TSMC’s 3nm node in 2H22.
Posted in IC Manufacturing, Package&Test, Semiconductors, Wafer Foundries
Tagged AMD, chiplets, CoWoS, CPU, foundry, IDM, InFO, Intel, outsourcing, SoIC, TSMC, UMC
Comments Off on TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
Strong End-Demand to Result in 8.6% and 46.2% YoY Growths for Smartphone and Tablet TDDI IC Shipments for 2021, Respectively, Says TrendForce
Given the forecasted recovery of the smartphone market and the corresponding rise in TDDI IC demand throughout this year, total smartphone TDDI IC shipment for 2021 is expected to reach 760 million units, according to TrendForce’s latest investigations. Tablet TDDI IC shipment for 2021, on the other hand, is expected to reach 95 million units.
Posted in Display, IC Design, Semiconductors, Upstream Components
Tagged COVID-19, Huawei, IC demand, TDDI
Comments Off on Strong End-Demand to Result in 8.6% and 46.2% YoY Growths for Smartphone and Tablet TDDI IC Shipments for 2021, Respectively, Says TrendForce